Wafer processing machine for producing semiconductors



FIG. 1 is a front view of a wafer processing machine for producingsemiconductors of the present invention;

FIG. 2 is a rear view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a Front View of Opening/Closing Part in Open State thereof;

FIG. 8 is an enlarged view thereof defined by the lines 8-8 and 8′-8′ inFIG. 7;

FIG. 9 is an enlarged sectional view thereof taken along the line 9-9 inFIG. 5 of the portion defined by the line 9′-9′ in FIG. 7;

FIG. 10 is an enlarged sectional view thereof taken along the line 10-10in FIG. 7 of the portion defined by the line 10′-10′ and 10″-10″ in FIG.3;

FIG. 11 is an enlarged sectional view thereof taken along the line 11-11in FIG. 7 of the portion defined by the line 11′-11′ and 11″-11″ in FIG.3;

FIG. 12 is an enlarged perspective view showing the claimed part andsurroundings;

FIG. 13 is an enlarged perspective view 1 of the left-side processingpart in FIG. 7, which is shown symmetrical to the enlarged perspectiveview of the right-side processing part in FIG. 7;

FIG. 14 is an enlarged perspective view 2 of the left-side processingpart in FIG. 7, which is shown symmetrical to the enlarged perspectiveview of the right-side processing part in FIG. 7; and,

FIG. 15 is an enlarged sectional view thereof taken along the line 15-15in FIG. 11 of the portion defined by the line 15′-15′ in FIG. 11.

The broken lines of the wafer processing machine for semiconductors arefor the purpose of illustrating portions of the article that form nopart of the claimed design.

The dash dot dash broken lines define the bounds of the claimed designand form no part thereof.

CLAIM The ornamental design for a wafer processing machine for producingsemiconductors, as shown and described.